Systems
ProVia FP-UC
Drilling and Cutting System


ProVia FP-UC laser drilling and cutting systems incorporate both UV and CO2 lasers and scan heads. The CO2 laser is appropriate for high speed drilling, cutting and skiving of dielectrics, while the UV laser is able to machine copper and provide higher process quality in many dielectrics.
System Features Include:
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Laser Via Drilling Systems
Datasheet
Options include autoloaders, integrated inspection microscopes, beam homogenizers, zoom telescopes, dual-head, dual-panel drilling and more..
A selection of videos including system tray loading, robotics, compact loader operation, ProVia laser processing and other automation features.
Industry 4.0 refers to a new stage in the Industrial Revolution which focuses on smart and autonomous systems fueled by data and machine learning.