Advanced laser solutions for interconnect and component production.
Laser drilling systems optimized for conventional and high performance materials, advanced packaging and embedded components in flex and rigid HDI PCBs.
ProVia systems are advanced volume production workstations for rigid, rigid-flex or flex panels, incorporating high performance beam positioning and laser control for high throughput drilling and routing of complex features.
Choose from Dual-laser (UV + CO2), UV, and CO2 lasers models
CO2 laser systems are appropriate for high speed drilling, cutting and skiving of dielectrics, while UV laser systems are able to drill and pattern copper and can provide higher process quality in many dielectrics. Whether your application is with glass or organic reinforced epoxies or non-reinforced materials (resin-coated foil or polyimide), there is a ProVia model to meet your requirements.
Blind Via Drilling
Through-hole Via Drilling
Buried Via Drilling
Cutting, Routing, Patterning
Dual-laser (UV + CO2) laser drilling system providing the broadest capability with optimum speed.
High repetition rate, high peak power CO2 laser system for drilling and cutting dielectric material.
PPI System Brochure
PPI Systems Inc.
ProSys Laser Resistor Trimming Software
Laser Drilling and Cutting
Laser Resistor Trimming
ProSys Laser Drilling Software
PCB Drilling & Cutting
Why PPI Systems
Ottawa Application Lab
© 2021 PPI Systems Inc. All rights reserved.